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In-depth report on electronic characteristics of semiconductor materials: the blood of wafer manufacturing Sub-gas, an important raw material for the semiconductor industry

2021-08-12

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Introduction to Electronic Gas

Electronic special gas (referred to as electronic special gas) is an important branch of special gas, and it is an indispensable raw material for the production of electronic industries such as integrated circuits (IC), flat display devices (LCD, LED, OLED), and solar cells.
Generally, the semiconductor production industry divides gases into two types: common gases and special gases. Among them, the commonly used gas refers to a centralized supply and uses a lot of gas, such as N2, H2, O2, Ar, He and so on. Special gas refers to some chemical gases used in the process of semiconductor production, such as extension, ion injection, blending, washing, and mask formation, that is, electronic gases in the gas category, such as high-purity SiH4, PH3, AsH3, B2H6, N2O, NH3, SF6, NF3, CF4, BCl3, BF3, HCl, Cl2, etc. In the IC production process, there are almost 100 kinds of electronic gases used, and about 30 kinds are common in the core section. It is these gases that make silicon chips have semiconductor properties through different manufacturing processes, which in turn determine the performance, integration, and yield of integrated circuits. Even if a certain specific impurity exceeds the standard, it will cause serious quality defects. In severe cases, the entire production line will be contaminated due to the diffusion of unqualified gas, and even the production will be completely paralyzed. Therefore, electronic gas is a key basic material in the electronic manufacturing process, and it is a veritable "blood" of the electronic industry.
The manufacture of integrated circuit chips requires the use of a variety of electronic gases, including silicon group gases such as silane, doping gases such as PH3, etching gases such as CF4, metal vapor deposition gases such as WF6, and other reactive gases and cleaning gases. In the preparation process of electronic grade silicon, the electronic gases involved include SiHCl3, SiCl4 and so on. The chemical vapor deposition (CVD) process on the surface of silicon wafers mainly involves SiH4, SiCl4, WF6 and so on. In the wafer manufacturing process, some processes involve the application of gas etching processes, also called dry etching. The electronic gases involved include CF4, NF3, HBr, etc. The amount of such etching gases is relatively small, and the etching process requires Together with related inert gases Ar, N2, etc., the etching degree is uniform. The doping process is to dope the required impurities into a specific semiconductor area to change the electrical properties of the semiconductor. The electronic gases involved include trivalent gases such as B2H6 and BF3 and pentavalent gases such as PH3 and AsH3.
The main types of electronic gases used in the flat-panel display industry include silicon group gases such as silane, doping gases such as PH3, and etching gases such as SF6. In the thin film process, SiO2, SiNx and other thin films are deposited on the glass substrate by chemical vapor deposition, and the special gases used are SiH4, PH3, NH3, NF3 and so on. In the dry etching process, the substrate is selectively etched in a plasma gas atmosphere. Usually use SF6, HCl, Cl2 and other gases.
Solar cells can be divided into crystalline silicon solar cells and thin-film solar cells. In the production of crystalline silicon cells, the diffusion process uses POCl3 and O2, the anti-reflection layer plasma enhanced chemical vapor deposition (PECVD) process uses SiH4 and NH3, and the etching process uses CF4. For thin-film solar cells, diethyl zinc (DEZn) and B2H6 are used in the process of depositing transparent conductive films, and silane is used in the process of depositing amorphous/microcrystalline silicon.

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